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Monday, February 06, 2006

 

Hitachi advances paper-thin RFID chip

Hitachi was due to present details of the 0.15-millimeter by 0.15-millimeter, 7.5-micron-thick chip on Sunday (Feb. 5) at the IEEE International Solid-State Circuits Conference (ISSCC) in San Francisco.

Paper is typically 80 microns to 100 microns thick, and the chip substrate has been made small and thinned to 7.5 micron to ease application in paper, where it could be used as an intelligent watermark.
Full Article by Yoshiko Hara

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